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UBM formation plating process for aluminum electrodes on a wafer.

UBM formation plating process for aluminum electrodes on a wafer.

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

  • Chemicals
  • Formation Plating Process

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Aluminum electrode on wafer UBM formation plating process

Aluminum electrode on wafer UBM formation plating process

Plating chemicals, total proposals for surface treatment processes and equipment, aluminum electrodes on wafers, UBM formation, plating process.

UBM (Under Barrier Metal) employs electroless Ni/Au plating and electroless Ni/Pd/Au plating; however, conventional processes have faced challenges such as localized corrosion of aluminum electrodes, poor plating appearance, and adhesion issues. Additionally, in recent years, as power semiconductors have advanced towards higher voltage and higher current, there is an increasing demand for enhanced heat resistance in electroless plating films. In response, we have newly developed the "TORYZA EL PROCESS," a plating process for forming UBM on aluminum electrodes that suppresses film reduction and localized corrosion while exhibiting excellent uniform deposition, smoothness, and adhesion of electroless Ni plating. Along with the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

  • Chemicals
  • Formation Plating Process

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